Table B-32. MSP-TS430PN80B Bill of Materials
Position
Ref Des
No. per
Board
Description
Digi-Key Part No.
Comment
1
PCB
1
90.0 x 92.5 mm
"MSP-TS430PN80B" Rev.
1.0
2 layers, blue solder mask
2
JP1, JP2,
JP9, JP13,
JP14, JP15
6
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
3
JP17, JP18
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on one side of header
4
JP10, JP11
2
2-pin header, male, TH
SAM1035-02-ND
DNP, keep pads free of solder
5
J1
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
6
JP3, JP4,
JP5, JP6,
JP7, JP8,
JP16
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
7
J2
1
3-pin header, male, TH
SAM1035-03-ND
8
R2, R5, R6,
R8, R9
5
0R, 0805
541-0.0ATR-ND
DNP
9
R3, R12,
R13
3
0R, 0805
541-0.0ATR-ND
10
C5
1
1.1nF, CSMD0805
490-1623-2-ND
11
C3, C7
2
1uF/10V, CSMD0805
490-1702-2-ND
12
R7, R15
2
10k, 0805
541-10KATR-ND
13
R4
1
47k, 0805
541-47KATR-ND
14
C4, C6,
C10, C11
4
100nF, CSMD0805
490-1666-1-ND
15
R1
1
330R, 0805
541-330ATR-ND
16
R10, R11
2
330R, 0805
541-330ATR-ND
DNP
17
R14
1
47k, 0805
541-47KATR-ND
DNP
18
C1, C2, C8,
C9
4
DNP, CSMD0805
DNP
19
SW2
1
EVQ-11L05R
P8079STB-ND
DNP, keep pads free of solder
20
SW1
1
EVQ-11L05R
P8079STB-ND
DNP, keep pads free of solder
21
TP1, TP2
2
Test point
DNP, keep pads free of solder
22
BSL
1
10-pin connector, male,
TH
HRP10H-ND
23
JTAG
1
14-pin connector, male,
TH
HRP14H-ND
24
U1
1
Socket IC201-0804-014
Manuf. Yamaichi
25
MSP device
1
MSP430FR5994
DNP: Not enclosed in kit
26
Q1
1
DNP: MS3V-TR1
(32768kHz, 20ppm,
12.5pF)
depends on application
Micro Crystal, DNP, enclosed in kit, keep
vias free of solder
Hardware
130
MSP430™ Hardware Tools
SLAU278AG – MAY 2009 – REVISED DECEMBER 2020
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