Table B-31. MSP-TS430PN80A Bill of Materials
Position
Ref Des
No. per
Board
Description
Digi-Key Part No.
Comment
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7,
C10, C12
3
10uF, 6.3V, SMD0805
DNP C10
4
C5, C11,
C13, C14,
C15
5
100nF, SMD0805
311-1245-2-ND
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
478-1403-2-ND
7
C16
1
4.7uF, SMD0805
8
C17
1
220nF, SMD0805
9
D1
1
green LED, SMD0805
P516TR-ND
10
J1, J2, J3,
J4
0
20-pin header, TH
SAM1029-20-ND (Header)
SAM1213-20-ND
(Receptacle)
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder:
11
J5 , J6
2
3-pin header, male, TH
12
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
13
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
14
10
Jumper
15-38-1024-ND
See Pos. 12 and Pos. 13
15
JTAG
1
14-pin connector, male,
TH
HRP14H-ND
16
BOOTST
0
10-pin connector, male,
TH
"DNP Keep vias free of solder"
17
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
DNP: Q1 Keep vias free of solder
18
Q2
0
Crystal
Q2: 4MHz Buerklin:
78D134
DNP: Q2 Keep vias free of solder
19
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/
Art_Detail.cfm?
ART_ARTNUM=70.08.121
20
D3,D4
2
LL103A
Buerklin: 24S3406
21
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
22
R1, R2, R4,
R6, R8,
R9,R10,
R11, R12
3
0 Ohm, SMD0805
541-000ATR-ND
DNP: R6, R8, R9, R10, R11,R12
23
R5
1
47k Ω, SMD0805
541-47000ATR-ND
24
U1
1
Socket:IC201-0804-014
Manuf.: Yamaichi
25
PCB
1
77 x 91 mm
2 layers
26
Adhesive
plastic feet
4
Approximately 6mm width,
2mm height
for example, 3M Bumpons
Part No. SJ-5302
Apply to corners at bottom side
27
MSP430
2
MSP430F5329IPN
DNP: enclosed with kit, supplied by TI
Hardware
SLAU278AG – MAY 2009 – REVISED DECEMBER 2020
MSP430™ Hardware Tools
127
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