GE/GC864-QUAD V2 and GE864-GPS Hardware User Guide
1vv0300915 Rev.5 – 2011-10-03
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved.
Page 81 of 94
14.1.3.
PCB pad design
Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
Recommendations for PCB pad dimensions
Ball pitch [mm]
2,5
Solder resist opening diameter A [mm]
1,150
Metal pad diameter B [mm]
1 ± 0.05
It is recommended no microvia without solder resist cover under the module and no microvia
around the pads (see following figure).
Holes in pad are allowed only for blind holes and not for through holes.
