Chapter 1: Introduction
1-13
1-2
Chipset Overview
Intel’s 845 chipset is made up of three main components:
The 82845 Memory Controller Hub (MCH) with an Accelerated Hub Architec-
ture (AHA) bus.
The 82801 BA I/O Controller Hub (ICH2) with an AHA bus.
The 82802 AB Firmware Hub (FWH).
Memory Controller Hub (MCH)
The MCH includes the host (CPU) interface, SDRAM interface, ICH2 inter-
face and 4xAGP interface for the 845 chipset. It contains advanced power
management logic and supports three DIMMS for up to 3 GB of unbuffered
SDRAM. The AGP 2.0 interface supports 4x data transfers and operates at
a peak bandwidth of 1056 GB. The MCH host interface bus runs at 400
MHz.
I/O Controller Hub (ICH2)
The I/O Controller Hub (ICH2) subsystem on the P4SBR/P4SBE integrates
many of the input/output functions of the 845 chipset, including a dual chan-
nel ATA-33/66/100 Bus Master IDE controller and two USB controllers that
offer 24 Mbps of bandwidth across four ports. It also provides the inter-
face to the PCI Bus and communicates with the MCH over a dedicated hub
interface bus -- the AHA. The ICH2 also features an enhanced AC97 inter-
face that supports full surround sound for the Dolby Digital Audio used on
DVDs.
Firmware Hub (FWH)
The FWH is a component that brings added security and manageability to
the PC platform infrastructure. This device includes an integrated Random
Number Generator (RNG) for stronger encryption, digital signing and secu-
rity protocols. The FWH stores the system BIOS and video BIOS to eliminate
a redundant nonvolatile memory component.
Summary of Contents for SUPER P4SBE
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