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Appendix B: System Specifications
Appendix B
System Specifications
Processors (per node)
Dual Intel Xeon Scalable Family 3rd Gen/4th Gen Series Processors (in Socket P+) with a thermal design power (TDP) of up
to 270W and three UPIs (UltraPath Interconnect) of up to 11.2GT/s
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel PCH C621A (LBG-R)
BIOS
AMI BIOS
ACPI 3.0 or later, PCI firmware 4.0 support, BIOS rescue hot-key, SPI dual/quad speed support, riser card auto detection
support, RTC (Real Time Clock) wakeup, and SMBIOS 3.0 or later
Memory (per node)
16 DRAM DIMMs plus two PMem (Intel® Optane™ PMem 200 Series). Up to 4TB RDIMM, DDR4-3200MHz in 16 memory
slots
Storage Drives
Front hot-swappable drives include:
12 NVMe/SATA drives for 620BT-HNTR
12 NVMe/SAS/SATA drives for 620BT-HNC8R
Internal M.2 drives per node include:
Default carrier with two M.2 NVMe/SATA SSDs
Optional carrier with two M.2 NVMe SSDs and Marvell HW RAID
Internal Connector:
VROC key header
PCI Expansion Slots (per node)
Two PCIe 4.0 x16
Networking (per node)
One AIOM or any compliant OCP 3.0 SFF Network Interface Card
One dedicated LAN port for BMC
Input/Output (per node)
Two USB 3.0 ports
One VGA port
Motherboard (per node)
X12DPT-B6 (WxL) 7.4" x 18.86" (187.96 mm x 479.04 mm)
Chassis
CSE-827BQ-R2K60P; 2U rackmount; (WxHxD) 17.6" x 3.5" x 30.5" (446 x 88 x 774mm)
System Cooling
Four 8-cm mid-chassis fans, two CPU heat sinks per node, and one air shroud per node