2
XTL-W7000
TABLE OF CONTENTS
1.
SERVICING NOTE
..................................................
3
2.
GENERAL
...................................................................
4
3.
DISASSEMBLY
3-1.
Disassembly Flow ........................................................... 11
3-2.
Front Panel Assy .............................................................. 12
3-3.
Case (Lower) Block ......................................................... 12
3-4.
Partition ........................................................................... 13
3-5.
Bracket (Slider) ............................................................... 14
3-6.
SLIDER Board ................................................................ 15
3-7.
Bracket (Motor) Assy ...................................................... 15
3-8.
Bracket (Motor S) Assy ................................................... 16
3-9.
Monitor Block ................................................................. 16
3-10. Gear (1), Gear (4) ............................................................ 17
3-11. Mechanism Complete Assy (DB-M01) ........................... 17
3-12. Liquid Crystal Display (LCD1) ....................................... 18
3-13. MAIN Board .................................................................... 18
4.
TEST MODE
.............................................................. 19
5.
ELECTRICAL ADJUSTMENTS
......................... 22
6.
DIAGRAMS
6-1.
Block Diagram – VIDEO, AUDIO Section – .................. 24
6-2.
Block Diagram – LCD, MOTOR Section – .................... 25
6-3.
Block Diagram
– CONTROL, POWER SUPPLY Section – .................... 26
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
6-4.
Printed Wiring Board – MAIN Section (1/2) – ............... 28
6-5.
Printed Wiring Board – MAIN Section (2/2) – ............... 29
6-6.
Schematic Diagram – MAIN Section (1/3) – .................. 30
6-7.
Schematic Diagram – MAIN Section (2/3) – .................. 31
6-8.
Schematic Diagram – MAIN Section (3/3) – .................. 32
6-9.
Printed Wiring Boards – FRONT PANEL Section – ....... 33
6-10. Schematic Diagram – FRONT PANEL Section – ........... 33
6-11. Printed Wiring Boards – SLIDER Section – ................... 34
6-12. Schematic Diagram – SLIDER Section – ....................... 35
6-13. Printed Wiring Board – MONITOR Section (1/2) – ....... 36
6-14. Printed Wiring Board – MONITOR Section (2/2) – ....... 37
6-15. Schematic Diagram – MONITOR Section (1/2) – .......... 38
6-16. Schematic Diagram – MONITOR Section (2/2) – .......... 39
6-17. Printed Wiring Board – KEY Section – .......................... 40
6-18. Schematic Diagram – KEY Section – ............................. 40
7.
EXPLODED VIEWS
7-1.
MAIN Board Section ....................................................... 55
7-2.
Front Panel Section ......................................................... 56
7-3.
Chassis (Main) Section .................................................... 57
7-4.
Monitor Section ............................................................... 58
7-5.
Open/close Mechanism Deck Section ............................. 59
8.
ELECTRICAL PARTS LIST
................................ 60
