Sega MARIO & SONIC AT THE RIO 2016 OLYMPIC GAMES, Owner'S Service Manual

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GAME BOARD
16
16-1 HANDLING PRECAUTIONS
● To prevent electric shock or IC Board malfunctioning, be sure to turn off the
power for the cabinet when installing or removing the IC Board.
● Extraneous matter such as dust on the IC Board can cause the IC Board to
generate heat and result in a fire due to short circuit, etc. Ensure the IC Board
surfaces are always kept clean.
● Always follow the usage conditions from SEGA as well as the usage conditions
for the cabinet you are using for Nu1.1. Failure to do so may cause an
overheating and fire.
● Be sure to connect the IC Board and connectors completely. Insufficient
insertion can damage IC Board, etc.
● For the IC Board circuit inspection, only the use of Logic Tester is permitted. The
use of ordinary testers is not permitted as these can damage the IC Board.
● Do not subject the IC Board to static electricity when installing the IC Board in
the cabinet or when connecting wire harness connectors to the IC Board.
● When soldering buttons, etc. to the wire harnesses, be sure to remove the wire
harnesses from the IC Board so as not to subject the IC Board to heat.
● Some parts are the ones designed and manufactured not specifically for this
product. The manufacturers may discontinue, or change the specifications of,
such general-purpose parts. If this is the case, SEGA cannot repair or replace a
failed product whether or not a warranty period has expired.
• It is important that the Nu1.1 Game Bd is cleaned free from dust regularly.
If dust accumulates within the Nu1.1 Game bd, the Game bd may
malfunction.
• If any components are removed during cleaning be sure to reconnect
them in the same manner as they were removed. Ill fitted components
may malfunction, become faulty or may possibly cause a fire hazard.
• If you are unsure about refitting components then please contact the point
of sale to arrange for a return or replacement Nu1.1 Game Bd.