COMe-cTL6 – User Guide Rev. 1.7
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Introduction
1.1.
Product Description
The COMe-cTL6 (E2) deliver high-performance, feature-rich Computer-on-Modules based on the standardized COM
Express® compact form factor and Intel`s single package BGA1449 System-on-Chip (SoC). The SoCs are containing
Intel® 11th Generation Core™/Celeron family. Through the use of COM Express connectors, the COMe-cTL6 is easily
exchangeable and offers the most flexibility for customers designing it into their embedded devices based on
individual carrier boards.
The Kontron COMe-cTL6 (E2) modules allow up to 48 GB of DDR4 memory. The board is also suited for harsh
operating conditions in industrial environments. For example, rugged modules are available that can be used within a
temperature range from -40°C to +85°C. The option with a soldered main memory (memory down) of up to 16 GB
DDR4 ensures even more robustness.
The COMe-cTL6 is ideally suited as a powerful successor for existing solutions, as it takes over their pin assignment
and feature implementation. Typical applications include communication, digital signage, professional gaming and
entertainment, medical imaging, surveillance and security, industrial edge computing as well as industrial plant-,
machine- and robot-control at the shop floor level and from the control room.
Basic COMe-cTL6 features are:
Dual/Quad -Core CPU on COM Express® compact form factor (Pin-out Type 6 compliant)
Based on 11th Gen Intel® Core™ technology
Up to 48 GB DDR4 non-ECC memory via 1x SO-DIMM socket (for up to 32 GB memory modules) + up to 16 GB non-
ECC memory down (on 2nd channel, optional)
Intel® Iris®Xe Graphics with up to four independent display support with 4K resolutions (up to 8K)
LVDS/eDP support
Up to 2.5Gb Ethernet, TSN support, WOL support
SATA 6 Gb/s & USB 3.1 Gen2 support
Support for Audio and common features (SPI, LPC, SMB)
TPM support
Optional vPro support
Optional NVMe SSD onboard
E2 versions for industrial grade temp. range (-40°C up to +85°C)
Figure 1: COMe-cTL6
