
5G Module Series
RM502Q-GL Hardware Design
RM502Q-GL_Hardware_Design 55 / 77
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)
In order to ensure RF performance and reliability, the following principles should be complied with in RF
layout design:
⚫
Use impedance simulation tool to control the characteristic impedance of RF traces as 50
Ω.
⚫
The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully
connected to ground.
⚫
The distance between the RF pins and the RF connector should be as short as possible. All the right
angle traces should be changed to curved ones, and the recommended angle is 135°.
⚫
There should be clearance area under the signal pin of the antenna connector or solder joint.
⚫
The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around
RF traces and the reference ground improves RF performance. The distance between the ground
vias and RF traces should be no less than two times the width of RF signal traces (2*W).
For more details about RF layout, please refer to
document [4]
.
5.4. Antenna Connectors
The ANT0, ANT1, ANT2_GNSSL1 and ANT3 antenna connectors are shown as below.