Phytec 1488.2, Hardware Manual

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PCM-065/phyCORE-i.MX8X System on Module L-864e.A1
© PHYTEC America LLC, 2021 23
9 Solder Jumpers
For configuration purposes the phyCORE-i.MX8X SOM has several solder jumpers. Figure 4 illustrates the
numbering of the solder jumper pads, while Figure 5 and Figure 6 indicate the location and the default
configuration of the solder jumpers on the board. Table 6 provides a functional summary of the solder jumpers
which can be changed to adapt the phyCORE-i.MX8X SOM to specific design needs. It shows their default
positions, possible alternative positions and functions.
Please pay special attention to the “TYPE” column to
ensure you are using the correct type of jumper (0 Ohms, 10k Ohms, etc.). The jumpers are a 0402 package
size with a 1/16W
or higher power rating.
Figure 4. Three-Position Solder Jumper Pad Numbering Scheme
Some of the phyCORE-i.MX8X power domains can be configured for 1.8V or 3.3V operation via these solder
jumpers. This allows for configuring the voltage levels of the associated I/O signals under these domains to meet
application requirements. These domains are detailed in
Table 5 :
Table 5. Voltage Domain Configurations
Voltage Domain Jumper Associated Signals
VDD_EMMC0 J10
EMMC_CLK/NAND_READY_B, EMMC_CMD/NAND_DQS,
EMMC_DATA0/NAND_DATA00, EMMC_DATA1/NAND_DATA01,
EMMC_DATA2/NAND_DATA02, EMMC_DATA3/NAND_DATA03,
EMMC_DATA4/NAND_DATA04, EMMC_DATA5/NAND_DATA05,
EMMC_DATA6/NAND_DATA06, EMMC_DATA7/NAND_DATA07,
EMMC_STROBE/NAND_CLE, EMMC0_RESET_B/NAND_WP_B
VDD_TMPR_CSI J6
X_CSI_DO0, X_CSI_DO1, X_CSI_DO2, X_CSI_DO3, X_CSI_DO4, X_CSI_DO5,
X_CSI_DO6, X_CSI_DO7, X_CSI_HSYNC, X_CSI_VSYNC
VDD_USDHC1_VSELECT J9
X_USDHC1_WP/NAND_DQS_N, X_USDHC1_CD_B/NAND_DQS_P,
X_USDHC1_RESET_B/NAND_RE_N, X_USDHC1_VSELECT/NAND_RE_P
If manual jumper modification is required, please ensure that the board as well as surrounding components and
sockets remain undamaged while desoldering. Overheating the board can cause the solder pads to loosen,
rendering the module inoperable. If soldered jumpers need to be removed, the use of a desoldering pump,
desoldering braid, an infrared desoldering station, desoldering tweezers, hot air rework station or other
desoldering method is strongly recommended. Follow the instructions carefully for whatever method of removal
is used.