2004 Mar 01
63
Philips Semiconductors
Product specification
Digital video encoder
SAA7102; SAA7103
9
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all ground pins connected together and
grounded (0 V); all supply pins connected together.
Notes
1. Condition for maximum voltage at digital inputs or I/O pins: 3.0 V < V
DDD
< 3.6 V.
2. Class 2 according to EIA/JESD22-114-B.
3. Class A according to EIA/JESD22-115-A.
10 THERMAL CHARACTERISTICS
Note
1. The overall R
th(j-a)
value can vary depending on the board layout. To minimize the effective R
th(j-a)
all power and
ground pins must be connected to the power and ground layers directly. An ample copper area direct under the
SAA7102; SAA7103 with a number of through-hole plating, which connect to the ground layer (four-layer board:
second layer), can also reduce the effective R
th(j-a)
. Please do not use any solder-stop varnish under the chip. In
addition the usage of soldering glue with a high thermal conductance after curing is recommended.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
DDD
digital supply voltage
−
0.5
+4.6
V
V
DDA
analog supply voltage
−
0.5
+4.6
V
V
i(A)
input voltage at analog inputs
−
0.5
+4.6
V
V
i(n)
input voltage at pins XTALI, SDA and SCL
−
0.5
V
DDD
+ 0.5
V
V
i(D)
input voltage at digital inputs or I/O pins
outputs in 3-state
−
0.5
+4.6
V
outputs in 3-state;
note 1
−
0.5
+5.5
V
∆
V
SS
voltage difference between V
SSA(n)
and V
SSD(n)
−
100
mV
T
stg
storage temperature
−
65
+150
°
C
T
amb
ambient temperature
0
70
°
C
V
esd
electrostatic discharge voltage
human body model;
note 2
−
±
2000
V
machine model;
note 3
−
±
150
V
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air
SAA7102E
38
K/W
SAA7103E
38
K/W
SAA7102H
53
K/W
SAA7103H
53
K/W