NANO 1000S Polisher
I
NSTRUCTION
M
ANUAL
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ▲
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: [email protected] W eb: https://www.metallographic.com
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
47
4.8.3.10 CLASS 10: Engineered Ceramics
(Example: Alumina and Sapphire Ceramic)
The preparation of hard / brittle /
porous ceramic materials are not
especially difficult with a few simple
preparation tricks. First, to minimize
grain pull-out (or fracturing in single
crystals) which may be falsely
characterized as porosity sectioning
damage must be minimized. This is
accomplished by sectioning with
the appropriate diamond wafering
blade and using the finest practical
abrasive for initial grinding. Planar
grinding is best achieved with the use of as small a diamond abrasive as possible
on a metal mesh cloth. Note there is a trade-off between planar grinding time
(abrasive size) and induced damage. In some cases, for ceramics, it is better to
take more time and minimize damage at planar grinding in order to reduce overall
polishing times. The use of SIAMAT colloidal silica also provides a chemical
mechanical polishing (CMP) action which is the most effective means for
eliminating both surface and subsurface damage. The combination of SIAMAT
colloidal silica with DIAMAT polycrystalline diamond also produces the required
surfaces finishes.
Sectioning:
Diamond Wafering Blade - Medium Grit / Low Concentration
Mounting:
Castable Mounting with Epoxy or Acrylic resins.
