NANO 1000S Polisher
I
NSTRUCTION
M
ANUAL
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3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: [email protected] W eb: https://www.metallographic.com
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
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4.7.3 Final Polishing
The purpose of final polishing is to remove only the cosmetic surface damage. It
should not be used to remove any damage remaining from cutting and planar
grinding. If the damage from these steps is not completely removed, the rough
polishing step should be repeated or continued.
Final Polishing Guidelines
Material
Recommendation
Metals
(Ferrous, Non-ferrous, Tool
Steels, Superalloys, etc.)
High-napped polishing pads with a nanometer
alumina polishing abrasive.
The polishing times should be nominally be less
than 30 seconds.
Ceramics and Ceramic
Matrix Composites (CMC)
Low-napped polishing pads using 1-
μ
m
polycrystalline diamond, alternating with colloidal
silica or colloidal silica alone.
Polymer Matrix Composites
(PMC)
Fine abrasive diamond-lapping films, followed by
a very light polish on a high-napped polishing
pad.
Biomaterials
Low-napped polishing pads with polycrystalline
diamond, alternating with colloidal silica.
Microelectronic Specimens
Diamond-lapping films followed by a very light
polish on a high-napped polishing pad.
Plastics and Polymers
Light polish with alumina on a high-napped
polishing pad.
Plasma Spray Materials
Diamond-lapping films followed by a very light
and short alumina or colloidal silica polish on a
high-napped polishing pad.