MSM9225B User’s Manual
Appendixes
A – 1
Appendix A
Package Dimensions
(Unit: mm)
QFP44-P-910-0.80-2K
Mirror finish
Package material
Epoxy resin
Lead frame material
42 alloy
Pin treatment
Solder plating (
≥
5µm)
Package weight (g)
0.41 TYP.
5
Rev. No./Last Revised
4/Nov. 28, 1996
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package
name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
Summary of Contents for MSM9225B
Page 7: ...Chapter 1 Overview...
Page 13: ...Chapter 2 Register Descriptions...
Page 53: ...Chapter 3 Operational Description...
Page 62: ...Chapter 4 Microcontroller Interface...
Page 71: ...Chapter 5 Electrical Characteristics...
Page 81: ...Appendixes...