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Control Connector Signal Descriptions And
Functions
Unless otherwise noted in the following sections, all digital signals will reference the following
specifications:
Parameter
Parameter/Conditions
Comments
MIN
TYP
MAX
UNIT
V
IH
High level Input voltage
1.17
1.83
V
V
IL
Low level Input voltage
-0.3
0.63
V
V
SHYS
Schmitt hysteresis voltage
15
mV
I
L
Input leakage current
V
DDX
= Max
V
IN
= 0 V to V
DDM
200
nA
V
OH
High level output voltage
I
OUT
= I
OH
1.35
1.8
V
V
OL
Low level output voltage
I
OUT
= I
OL
0
0.45
V
I
OH
High level output voltage
3
mA
I
OL
Low level output voltage
CMOS, at pin rated drive
strength
3
mA
C
IN
Input Capacitance
5
pF
Module Power (PINS 87, 89, 91, 93, 95, 97, 99)
The HS 3001 module uses a single voltage source of V
CC
= +3.4 V to 4.4 V.
VBAT
Parameter/Conditions
Min
(mA)
Typ
(mA)
Max
(mA)
Units
Main Battery Supply
Voltage In Regulation
3.4
4.4
Vdc
Peak Current
1000 µF on Host at Module Connector
600mA 680mA mA
The uplink burst will cause strong ripple on the voltage lines and should be
filtered effectively. We recommend that 1000
µ
F of capacitance be placed as
close to the modem I/O connector as possible. It should be noted that the input
voltage level should not drop below the minimum voltage rating under any
circumstances, especially during the uplink burst period.
Summary of Contents for HS 3001
Page 1: ...CNN0301IG001 HS 3001 Integration Guide Version 1 04 01 July 2013 ...
Page 15: ... xiv USB Driver Installation Windows 7 48 ...
Page 21: ... 6 2 Module Power Operating Power ...
Page 25: ... 10 Figure 3 2 Host Board Layout ...
Page 26: ... 11 Figure 3 3 Host Pads for Board To Board RF Connector ...
Page 42: ... 27 Audio Schematics ...
Page 43: ... 28 Figure 4 6 Audio Reference Design Schematic ...
Page 70: ... 55 Figure 5 18 Novatel Wireless M2M Driver Setup Utility Attached Devices Window ...