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Figure 3-1 Pin 1 Reference, 100-Pin I/O Connector
Module Mounting To Host Board (Reference)
Solder the module to a PCB using the mounting tabs provided.
These tabs provide circuit grounding for the module.
Do not add solder paste to mounting pads, RF connector, or shield pads.
The only portion recommended for thermal relief is along the outer edge of each
pad, where you would place a soldering iron. The rest of the pad should be solid
flood to the copper ground underneath the module. (See Figure 5) This is critical
for helping heat dissipation.
Summary of Contents for HS 3001
Page 1: ...CNN0301IG001 HS 3001 Integration Guide Version 1 04 01 July 2013 ...
Page 15: ... xiv USB Driver Installation Windows 7 48 ...
Page 21: ... 6 2 Module Power Operating Power ...
Page 25: ... 10 Figure 3 2 Host Board Layout ...
Page 26: ... 11 Figure 3 3 Host Pads for Board To Board RF Connector ...
Page 42: ... 27 Audio Schematics ...
Page 43: ... 28 Figure 4 6 Audio Reference Design Schematic ...
Page 70: ... 55 Figure 5 18 Novatel Wireless M2M Driver Setup Utility Attached Devices Window ...