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Figure 4-2 Example of a POOR RF Thermal Relief
If thermal relief is necessary, use short, fat traces. This will still provide a solderable
connection, while providing a better RF connection. Making the traces shorter also allows for a
more continuous ground plane due to less copper being removed from the area. We also
recommend that you have ground vias around all thermal relief of critical ground pins such as
the five cellular shield tabs.
Summary of Contents for HS 3001
Page 1: ...CNN0301IG001 HS 3001 Integration Guide Version 1 04 01 July 2013 ...
Page 15: ... xiv USB Driver Installation Windows 7 48 ...
Page 21: ... 6 2 Module Power Operating Power ...
Page 25: ... 10 Figure 3 2 Host Board Layout ...
Page 26: ... 11 Figure 3 3 Host Pads for Board To Board RF Connector ...
Page 42: ... 27 Audio Schematics ...
Page 43: ... 28 Figure 4 6 Audio Reference Design Schematic ...
Page 70: ... 55 Figure 5 18 Novatel Wireless M2M Driver Setup Utility Attached Devices Window ...