User’s Manual U15075EJ2V1UD
337
CHAPTER 23 RECOMMENDED SOLDERING CONDITIONS
The
µ
PD789426, 789436, 789446, and 789456 Subseries should be soldered and mounted under the following
recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 23-1. Surface Mounting Type Soldering Conditions (1/3)
(1)
µ
PD789425GK-
×××
-9ET: 64-pin plastic TQFP (12
×
12)
µ
PD789426GK-
×××
-9ET: 64-pin plastic TQFP (12
×
12)
µ
PD789435GK-
×××
-9ET: 64-pin plastic TQFP (12
×
12)
µ
PD789436GK-
×××
-9ET: 64-pin plastic TQFP (12
×
12)
µ
PD789445GK-
×××
-9ET: 64-pin plastic TQFP (12
×
12)
µ
PD789446GK-
×××
-9ET: 64-pin plastic TQFP (12
×
12)
µ
PD789455GK-
×××
-9ET: 64-pin plastic TQFP (12
×
12)
µ
PD789456GK-
×××
-9ET: 64-pin plastic TQFP (12
×
12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time:30 seconds max. (at 210
°
C or higher),
Count: Two times or less, Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for
10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°
C, Time:40 seconds max. (at 200
°
C or higher),
Count: Two times or less, Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for
10 hours)
VP15-107-2
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature),
Exposure limit: 7 days
Note
(after that, prebake at 125
°
C for 10 hours)
WS60-107-1
Partial heating
Pin temperature: 350
°
C max., Time: 3 seconds max. (per pin row)
−
Note
After opening the dry peak, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).