APPENDIX C CONNECTORS FOR TARGET CONNECTION
User’s Manual U14700EJ2V0UM
46
C.2 Cautions on Handling Connectors
(1) When taking connectors out of the case, remove the sponge while holding the main unit.
(2) When soldering the NQPACK144SD to the target system, cover it with the HQPACK144SD for protection against
splashing flux.
Recommended soldering conditions… Reflow:
240
°
C, 20 seconds max.
Partial heating:
240
°
C, 10 seconds max. (per pin row)
(3) Check for abnormal conditions such as resin burr or bent pins before mounting a device on the NQPACK144SD.
Moreover, when covering with the HQPACK144SD, check that the hold pins of the HQPACK144SD are not
broken or bent before mounting the HQPACK144SD. If there are broken or bent pins, fix them with a thin, flat
plate such as a blade.
(4) When securing the YQPACK144SD (connector for emulator connection) or HQPACK144SD to the
NQPACK144SD with screws, tighten the four screws temporarily with the screwdriver provided or a driver with a
torque gauge, then tighten the screws in a crisscross pattern (with 0.054 N
⋅
m max. torque).
Excessive tightening of only one screw may diminish conductivity.
If the conductivity is diminished after screw-tightening, stop tightening, remove the screws and make sure the
NQPACK144SD is clean and the device pins are parallel (flat).
(5) Device pins do not have high strength. Repeatedly connecting to the NQPACK144SD may cause pins to bend.
When mounting a device on NQPACK144SD, check and adjust bent pins.
