Now it's time to solder the first IC, IC1.
If you have a flux pen, the application of flux to the pads will help soldering the ICs. If you're going
to use one, apply some flux to the pads of both IC1 & IC2.
In a similar way to how you soldered the previous components, place a small blob of solder to one
of the outer pins of IC1.
Gently take one of the NE5532 ICs in the tweezers. Place it on the PCB close to IC1 location,
ensuring that you know which side has pin 1. Orient the IC so that it's ready to slide into place.
Place the tip of the soldering iron on the outside edge of the soldered pad, so that the solder melts.
Quickly slide the IC into place, trying to ensure that the IC's other legs are sat squarely on the other
pads. Remove the soldering iron as quickly as you can to avoid overheating the IC. If the IC isn't
quite sat squarely on the pads, re-apply the soldering iron to the soldered pad, & gently nudge the
IC into place with the tweezers. Again, try to minimise the time that the IC is being heated up. If
you've used it, the stickiness of the flux will help hold the IC in place. Don't worry too much about
the soldering itself on this joint right now, we're really aiming to hold the device in place with this
joint right now. We can redo this later once the other pins are soldered.
MTM SimpleEQ 0805 build doc v1.1
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