MECHANICAL PARTS REWORK AND REPAIR:
Recommended Equipment
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CHAPTER 9
MECHANICAL PARTS REWORK AND REPAIR
The following section details the equipment and procedures needed to correctly remove and replace
specific Main Board components on the
i
580.
9.1
Recommended Equipment
9.1.1
Hot Air Machine
Pace ThermoFlo 200 or similar.
9.1.2
Preheater
X-Kar 1000-S or similar.
9.1.3
High Performance Soldering Station
Pace HeatWise 200 with thermal recovery system or similar.
1. .6mm (0.06”) CHISEL (P/N1124-0019-P1) to fill lands (Big) during Land Preparation
procedure.
2. 0.40mm (0.016”) 1/64” 60° BEVEL (P/N1124-0011-P1) to fill/level lands (Big) during Land
Preparation procedure.
3. 10.80mm (.425”) BLADE (P/N1124-0501-P1) to wick off or level solder (BGAs) during Land
Preparation procedure.
9.1.4
Microscope
Leica Stereozoom 6 or similar.
9.1.5
Magnifier Lamp
5-diopter magnifier lamp.
9.1.6
Fume Absorber
Pace Arm-Evac 200 or similar.