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8
Installation
Logic wires from other input devices, such as motion controllers and
PLL velocity controllers, must be separated from power lines in the
same manner as the logic I/O on this drive.
Heat sinking
MMRG Series drives require an additional heat sink when the
continuous armature current is above 5 ADC. Use Minarik heat sink
kit part number 223-0159. Use a thermally conductive heat sink
compound (such as Dow Corning
®
340 Heat Sink compound)
between the drive chassis and the heat sink surface for optimum
heat transfer. Model MMRG31U does not require an additional heat
sink.
Summary of Contents for MMRG Series
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