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Figure 6-3. GND Pads Overview and Layout Recommendation
WRONG
GOOD
Note:
It is recommended to use the layout as shown on the right above. This solution increases RF performance of
the Wi-Fi and Bluetooth communications and optimizes heat sink capability of the system; on the host board, do not
apply thermal brakes on the TOP layout around GND pads.
Note:
A full GND plane with evenly distributed GND vias should be placed underneath the module, on the top layer
of the host board.
6.3
Other Characteristics
Table 6-4. ATSAMA5D27-WLSOM1 Other Characteristics
Parameter
Measurement
Comments
Value
Unit
Weight
7.91
g
SAMA5D27 Wireless SOM1
Mechanical Characteristics
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and its subsidiaries
Complete Datasheet
DS60001590D-page 55