![Microchip Technology ATSAMA5D27-WLSOM1 Manual Download Page 54](http://html1.mh-extra.com/html/microchip-technology/atsama5d27-wlsom1/atsama5d27-wlsom1_manual_1785812054.webp)
6.2
Module Land Pattern (Host Board PCB Footprint)
Figure 6-2. ATSAMA5D27-WLSOM1 Land Pattern Drawing
LAND PATTERN RECOMMENDATIONS
PIN 1 CORNER
S1
S2
W
k
L
Inside <S1-S2> square, keepout area
No signals and power vias, no tracks are allowed.
Pads :
Body :
188
40.8 x 40.8 x 3.287
B01
SAMA5D27-WLSOM1_POD
11/15/2019
SAMA5D27-WLSOM1 DIMENSIONS
Drawn by : R C R
Pads Pitch :
0.8
10.75
9.75
8.5
3.25
1.25
0.2
10
1
8.5
10.9
4.75
3.75
4
5
2.5
1
0.2
1.6
1.6
Table 6-3. ATSAMA5D27-WLSOM1 Land Pattern Dimensions (in mm)
Parameter
Symbol
Common Dimensions
Comments
Min.
Typ.
Max.
Land Pattern Pad Width
W
–
0.600
–
Solder Mask Defined 0.550
Land Pattern Pad Length
L
–
2.000
–
–
Land Pattern Pad X Space
S1
–
37.800
–
–
Land Pattern Pad Y Space
S2
–
37.800
–
–
Land Pattern Pad Space
k
–
0.200
–
–
SAMA5D27 Wireless SOM1
Mechanical Characteristics
©
2021 Microchip Technology Inc.
and its subsidiaries
Complete Datasheet
DS60001590D-page 54