Lattice CrossLink LIF-MD6000 Master Link Board - Revision C, User Manual

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CrossLink LIF-MD6000 Master Link Board - Revision C
Evaluation Board User Guide
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FPGA-EB-02018-1.0 35
Appendix D. SMA-IOL-EVN-BRD Bill of Materials
SMA IO Link Board Bill of Materials
Item Reference Qty Part PCB Footprint Comments PART_NUMBER Manufacturer Description
1
GND1, +5 V, +1.8 V,
+3.3 V, SN, SDA,
SCLK, SCL, RESETN,
MOSI, MISO, GND
12 TP_S_40_63 tp_s_40_63 DNI — —
Square test point, 40 mil
inner diameter, 63 mil
outer diameter
2 C1, C4 2 1 µF C0402 — C0402C105K9PACTU Kemet
CAP CERAMIC
1 µF 6.3 V X5R 0402
3 C2, C5 2 0.1 µF C0402 — C0402C104K4RACTU Kemet
CAP CERAMIC 0.1 µF 16 V
X7R 0402
4
C3, C6 2 0.01 µF C0402 — C0402C103J4RACTU Kemet
CAP CERAMIC
10 nF 16 V 5% X7R 0402
5
J1, J2, J3, J4, J5, J6,
J7, J8, J9, J10, J11,
J12, J13, J14
14 73391-0060 73391-0060 — 73391-0060 Molex
Molex Straight 50O
Through Hole SMA
Connector, jack, Solder
Termination
6
MH1, MH2 2 Thru Hole MTG125 — — — —
7 U1 1
Hirose - FX12 -
40 Pos
Hirose-FX12S — FX12B-40S-0.4SV
Hirose Electric Co
Ltd
Conn Board to Board PL
40 POS
0.4 mm Solder ST SMD
T/R
8
SMA IOLINK BOARD
PCB
1 — — — 305-PD-15-0589 PACTRON —