CP6016
Introduction
ID 1022-3074, Rev. 2.0
Page 1 - 17
P R E L I M I N A R Y
In addition, boards ordered with the ruggedized service comply with the following standards as
well.
1.8
Related Publications
The following publications contain information relating to this product.
Table 1-3:
Additional Standards for Boards Ordered with Ruggedized Service
TYPE
ASPECT
STANDARD
REMARKS
Environmental
Vibration
(Sinusoidal)
IEC60068-2-6
Ruggedized version test parameters:
• 5-150 (Hz) frequency range
• 1 (g) acceleration
• 1 (oct/min) sweep rate
• 10 cycles/axis
• 3 axis
Single Shock
IEC60068-2-27
Ruggedized version test parameters:
• 15 and 30 (g) acceleration
• 9 (ms) pulse duration
• 3 shocks per direction
• 6 directions
• 5 (s) recovery time
Note ...
The values indicated in the table above are valid for the CP6016 equipped with
the heat sink illustrated in Figure 1-3.
Table 1-4:
Related Publications
PRODUCT
PUBLICATION
CompactPCI Systems and
Boards
CompactPCI Specification PICMG 2.0, Rev. 3.0
CompactPCI Packet Switching Backplane Specification PICMG 2.16 Rev. 1.0
CompactPCI System Management Specification PICMG 2.9 Rev. 1.0
CompactPCI Hot Swap Specification PICMG 2.1 Rev. 2.0
IPMI - Intelligent Platform Management Interface Specification v1.5
Kontron
CompactPCI Backplane Manual, ID 24229
PMC Module
IEEE 1386-2001, IEEE Standard for a Common Mezzanine Card (CMC) Family
IEEE 1386.1-2001, IEEE Standard Physical and Environmental Layers for PCI
Mezzanine Cards (PMC)
XMC Module
ANSI/VITA 42.0-200x XMC Switched Mezzanine Card Auxiliary Standard
ANSI/VITA 42.3-2006 XMC PCI Express Protocol Layer Standard
Platform Firmware
Unified Extensible Firmware Interface (uEFI) specification, version 2.1
All Kontron products
Product Safety and Implementation Guide, ID 1021-9142
