COMe-bSL6 – User Guide Rev. 1.4
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2.9.
Mechanical Specification
2.9.1.
Dimensions
The dimensions of the module are:
95.0 mm x 125.0 mm (3.75 ” x 4.92 “)
Figure 2: Module Dimensions
2.9.2.
Height
The COM Express® specification defines a module height of approximately 13 mm from module PCB bottom to
heatspreader top, as shown in the figure below.
Figure 3: Module Height
Cooling solutions provided by Kontron for basic sized Computer-on-Modules are 27 mm in height from module
bottom to heatsink top. Universal Cooling solutions to be mounted on the heatspreader are 14.3 mm in height for an
overall height of 27.3 mm from module bottom to heatsink top.
