COMe-bEP7 Module User Guide
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8.1.1.
Height
The height of the module depends on the height of the implemented cooling
solution. The height of the cooling solution is not specified in the COM Express®
specification.
The COM Express® specification defines a module height of approximately 13 mm
from module PCB bottom to heatspreader top, as shown in Figure 8: Module Height
below.
Figure 8: Module Height
1.
Heatspreader
2.
Heatspreaader standoff(s)
3.
Module PCB
4.
Carrier Board PCB
5.
Connector standoff(s) 5 mm or 8
mm
6.
13 mm +/- 0.65 mm
8.2.
Thermal Management, Heatspreader and Cooling Solutions
A heatspreader plate assembly is available from Kontron for the COMe-bEP7. The
heatspreader plate on top of this assembly is NOT a heat sink. It works as a COM
Express®-standard thermal interface to use with a heat sink or external cooling
devices.
External cooling must be provided to maintain the heatspreader plate at proper
operating temperatures. Under worst case conditions, the cooling mechanism must
maintain an ambient air and heatspreader plate temperature on any spot of the
heatspreader's surface according the module specifications:
60°C for commercial grade modules
85°C for industrial temperature grade modules (E2)
You can use many thermal-management solutions with the heatspreader plates,
including active and passive approaches.
The optimum cooling solution varies, depending on the COM Express® application
and environmental conditions. Active or passive cooling solutions provided from
Kontron for the COMe-bEP7 are usually designed to cover the power and thermal
dissipation for a commercial grade temperature range used in a housing with
proper air flow.
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