Kirisun DM588, Service Manual

Page: 59 / 151

DM588 Service Manual
SN Material NO Material Name Specifications QTY Component NO
227
2RT1-NCP18WF10
4J03RB
SMD thermistor 1608, NCP18WF104J03RB 1 R333
228 2RS1-16-221J R chip resistor
1608, 220Ω±5%
2 R336,R341
229
5OC1-50R0-DSB32
-2509
SMD crystal oscillator,
For model DM588VHF\DP585VHF,
KDS, DSB321SDN, 50.4MHz, 0.5ppm,
-40~+85°C, 3.2*2.5*0.9mm
1 U3
230 2RS1-16-823J R chip resistor 1608, 82K±5% 2 R337,R342
231 7MDC-4207-05A-W
Amplifier shield cover
(for model DP586)
Copper-Nickel-Zinc alloy, 0.2 mm thick,
square, 16.3*10.95*2, Chuanghong
brand, lead free
6 V1,V2,V3,V4,V5,V6
232 7MDC-4207-04A-W
Power shield cover (for
model DP586)
Copper-Nickel-Zinc alloy, 0.2 mm thick,
square, 16.2*15.1*2.3, Chuanghong
brand, lead free
4 S1,S2,S3,S4
233 7MDC-4207-01A-W
VCO shield cover (for
model DP586)
Copper-Nickel-Zinc alloy, 0.2 mm thick,
square, 31.05*13.3*3, Chuanghong
brand, lead free
4 P1,P2,P3,P4
234 7MDC-4207-03A-W
APC shield cover (for
model DP586)
Copper-Nickel-Zinc alloy, 0.2 mm thick,
square, 21.3*11.45*2.2, Chuanghong
brand, lead free
1 Y1
235 7MDC-4072-08A-W STP-V shield cover 2
Material: Copper-Nickel-Zinc alloy
(T=0.2), 14.3*11.65*1.9, original color,
Junyu brand, lead free
1 X1
236 6PM7-4291-HMB Main board
DM588_MAIN_171113,
138X85.8X1.6MM, 6-layer, FR-4, lead
free
1
237
2CC1-10-C0G500-3
60J
R multi-layer chip
capacitor
1005, 36P±5%, 50V, C0G 1 C184
238
2CC1-28-C0G1000-
560D
High-Q capacitor,
high-voltage
1111 encapsulation, 56pF 1 C583
56