QS8M
QFN Style Solder-Down Computer On Module
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Solder-down version
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27mm square
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2.3mm total height
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QFN type lead style
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1mm pitch
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100 pads
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Thermal pad
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Visual solder joint inspection possible after soldering
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Single-sided assembly
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3.3V power supply
Key Features
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NXP i.MX 8M Mini
Quad Cortex-A53 up to 1.6GHz
Cortex-M4 up to 400MHz
NXP i.MX 8M Nano Dual Cortex-A53 up to 1.4GHz
Cortex-M7 up to 600MHz
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RAM
512MB/1GB DDR3L
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ROM
4GB eMMC
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Grade
Industrial
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Temperature
-25°C to 85°C
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Display support
1x MIPI DSI (4-lane) display interface
i.MX 8M Mini:
GC328 2D GPU,
GCNanoUltra 3D GPU,
1080p60 Video de-/encode
i.MX 8M Nano:
GC7000UltraLite 3D GPU
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Connectivity
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1x MIPI CSI (4-lane) camera interface
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1x Gb Ethernet, 1x/2x USB2.0, 1x eMMC/SD
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4x UART, 3x I²C, 2x SPI, 4x PWM, SAI, SPDIF
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Up to 70x 3.3V General Purpose I/O
OS Support
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Linux
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Windows 10 IoT
Ka-Ro electronics GmbH - Pascalstr. 22, D-52076 Aachen, Germany - Tel.: +49 2408 1402-0 (FAX -10)
www.karo-electronics.de
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