Intel® Server Board M50CYP2SB Family Technical Product Specification
46
Memory mode:
•
Populate each memory channel with at least one DRAM DIMM to maximize bandwidth.
•
Intel® Optane™
persistent memory 200 series modules must be populated symmetrically for each
installed processor (corresponding slots populated on either side of each processor).
App Direct mode:
•
Minimum of one DDR4 DIMM per IMC (IMC 0, IMC 1, IMC 2 and IMC 3) for each installed processor.
•
Minimum of one Intel®
Optane™ persistent memory
200 series module for the board.
•
Intel®
Optane™ pe
rsistent memory 200 series modules must be populated symmetrically for each
installed processor (corresponding slots populated on either side of each processor).
Table 7.
Intel® Optane™
Persistent Memory 200 Series Module Support
Processor Shelf
Intel® Optane™
Persistent Memory 200
Series Capacity (GB)
Speed (MT/s)
Silver 4300 processors
(Silver 4314 processor SKU only)
128
256
512
2666
2400
Gold 5300 processors
128
256
512
2933
2666
2400
Gold 6300 Processors*
128
256
512
3200
2933
2666
2400
Platinum 8300 processors
128
256
512
3200
2933
2666
2400
Note:
*Gold processor SKU 6330 maximum speed is 2933 (MT/s).
Table 8. Standard DDR4 DIMMs Compatible with In
tel® Optane™
Persistent Memory 200 Series Module
Type
Ranks per DIMM and
Data Width
DIMM Size (GB)
8 Gb DRAM density
16 Gb DRAM density
RDIMM
(PTH
–
up to 2933 MT/s)
(SMT
–
up to 3200 MT/s)
SR x8
N/A
N/A
SR x4
16
32
DR x8
16
32
DR x4
32
64
3DS-RDIMM
(PTH
–
up to 2933 MT/s)
(SMT
–
up to 3200 MT/s)
QR x4
N/A
128 (2H)
OR x4
N/A
256 (4H)
LRDIMM
(PTH/SMT
–
up to 3200 MT/s)
QR x4
64
128
3DS-LRDIMM
(PTH/SMT
–
up to 3200 MT/s)
QR x4
N/A
N/A
OR x4
128 (4H)
256 (4H)
Note:
SR = Single Rank, DR = Dual Rank, QR = Quad Rank, OR = Oct Rank, H = Stack Height, PTH = Plated
Through Hole, SMT = Surface-Mount Technology
