Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007
TDG
Order Number: 315279 - 003US
5
Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
Figures
1
Package IHS Load Areas ........................................................................................... 11
2
Processor Case Temperature Measurement Location ..................................................... 15
3
Example Thermal Profile ........................................................................................... 16
4
Processor Thermal Characterization Parameter Relationships ......................................... 22
5
Locations for Measuring Local Ambient Temperature, Active Heatsink.............................. 24
6
Locations for Measuring Local Ambient Temperature, Passive Heatsink ............................ 25
7
Concept for Clocks under Thermal Monitor Control........................................................ 28
8
Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 29
9
T
CONTROL
for Digital Thermal Sensor ............................................................................. 32
10 Thermal Characterization Parameters for Various Operating Conditions ........................... 34
11 PICMG 1.3 Copper Heatsink....................................................................................... 35
12 PICMG 1.3 Heatsink Performance ............................................................................... 36
13 Intel® QST Overview ............................................................................................... 39
14 PID Controller Fundamentals ..................................................................................... 40
15 Intel® QST Platform Requirements............................................................................. 41
16 Example Acoustic Fan Speed Control Implementation.................................................... 42
17 Digital Thermal Sensor and Thermistor ...................................................................... 43
18 Board Deflection Definition ........................................................................................ 46
19 Example: Defining Heatsink Preload Meeting Board Deflection Limit ................................ 48
20 PICMG 1.3 Motherboard Keep-out Footprint Definition and Height Restrictions for Enabling
Components, Primary Side ........................................................................................ 54
21 PICMG 1.3 Motherboard Keep-out, Secondary Side ....................................................... 55
Tables
1
Referenced Documents ...............................................................................................9
2
Terms Used...............................................................................................................9
3
Thermal Characterization Parameter at various T
LA
's..................................................... 33
4
Board Deflection Configuration Definitions ................................................................... 45
5
Intel Reference Component PICMG 1.3 Thermal Solution Providers ................................. 56