Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
October 2007
TDG
Order Number: 315279 -003US
11
Processor Thermal/Mechanical Information—Intel
®
Core
TM
2 Duo E6400, E4300, and Intel
®
Pentium
®
Dual-Core E2160 Processor
2.0
Processor Thermal/Mechanical Information
2.1
Mechanical Requirements
2.1.1
Processor Package
The processor is packaged in a 775-Land LGA package that interfaces with the
motherboard via a LGA775 socket. Refer to the datasheet for detailed mechanical
specifications.
The processor connects to the motherboard through a land grid array (LGA) surface
mount socket. The socket contains 775 contacts arrayed about a cavity in the center of
the socket with solder balls for surface mounting to the motherboard. The socket is
named LGA775 socket. A description of the socket can be found in the LGA775 Socket
Mechanical Design Guide.
The package includes an integrated heat spreader (IHS) that is shown in
Figure 1
.
Refer to the processor datasheet for more information. In case of conflict, the package
dimensions in the processor datasheet supersedes dimensions provided in this
document.
Figure 1.
Package IHS Load Areas
To p S u rfa c e o f IH S
to i n s ta ll a h e a ts i n k
IH S S te p
to i n te rfa c e w i th LGA7 75
S o c k e t Lo a d P la te
S u b s tra te
To p S u rfa c e o f IH S
to i n s ta ll a h e a ts i n k
IH S S te p
to i n te rfa c e w i th LGA7 75
S o c k e t Lo a d P la te
S u b s tra te