16
Datasheet
Electrical Specifications
2.3.1
V
CC
Decoupling
Regulator solutions need to provide bulk capacitance with a low Effective Series Resistance (ESR)
and keep a low interconnect resistance from the regulator to the socket. Bulk decoupling for the
large current swings when the part is powering on, or entering/exiting low power states, must be
provided by the voltage regulator solution (VR). For more details on this topic, refer to the
Voltage
Regulator Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket
.
2.3.2
FSB GTL+ Decoupling
The Pentium 4 processor in the 775-land package integrates signal termination on the die as well as
incorporating high frequency decoupling capacitance on the processor package. Decoupling must
also be provided by the system baseboard for proper GTL+ bus operation.
2.3.3
FSB Clock (BCLK[1:0]) and Processor Clocking
BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the processor.
As in previous generation processors, the Pentium 4 processor in the 775-land package core
frequency is a multiple of the BCLK[1:0] frequency. The processor bus ratio multiplier will be set
at its default ratio during manufacturing. No user intervention is necessary, and the processor will
automatically run at the speed indicated on the package.
The Pentium 4 processor in the 775-land package uses a differential clocking implementation. For
more information on the Pentium 4 processor in the 775-land package clocking, refer to the
CK410/CK410M Clock Synthesizer/Driver Specification
.
Table 2-1. Core Frequency to FSB Multiplier Configuration
Multiplication of System Core
Frequency to FSB Frequency
Core Frequency (200 MHz
BCLK/800 MHz FSB)
Notes
1, 2
NOTES:
1.
Individual processors operate only at or below the rated frequency.
2.
Listed frequencies are not necessarily committed production frequencies.
1/14
2.80 GHz
-
1/15
3 GHz
-
1/16
3.20 GHz
-
1/17
3.40 GHz
-
1/18
3.60 GHz
-
1/19
3.80 GHz
-
Summary of Contents for 520J - Pentium 4 2.80GHz 800MHz 1MB Socket 775 CPU
Page 8: ...8 Datasheet Contents...
Page 10: ...10 Datasheet Contents...
Page 14: ...14 Datasheet Introduction...
Page 36: ...36 Datasheet Package Mechanical Specifications Figure 3 2 Processor Package Drawing 1...
Page 37: ...Datasheet 37 Package Mechanical Specifications Figure 3 3 Processor Package Drawing 2...
Page 38: ...38 Datasheet Package Mechanical Specifications Figure 3 4 Processor Package Drawing 3...
Page 74: ...74 Datasheet Land Listing and Signal Descriptions...
Page 84: ...84 Datasheet Thermal Specifications and Design Considerations...