6
Product Specification
2.2
Specification
Processor
Intel® Xeon Scalable processor, TDP up to 165W
Chipset
Intel® C622
Memory
Memory Type
DDR4 RDIMM/LRDIMM
Memory Slot Qty.
16
Total Memory Capacity
Supports up to 512GB (32GB per memory module)
Port and Connector
USB
Two USB 3.0 ports (front side)
VGA
One VGA port (front side)
Mgmt
One RJ45 IPMI port (front side)
Expansion Slot
Option 1: Two PCIe Gen3 x16 FHFL
Option 2: One PCIe Gen3 x16 HHHL + Two PCIe Gen3 x8
HHHL
OCP Slot
One OCP card, OCP2.0 x16 slot on the motherboard
Storage Drive
One
SATA/PCIe x4 M.2
card on the motherboard
Power
Centralized OCP Power Shelf, compliant with Open Rack
v2
Physical
Dimension
830mm (L) × 537mm (W) × 95.2mm (H)
Product Weight
Full
configuration: 7kg
Cubby weight: 15kg (one
cubby is available for 3
compute sleds)
Environmental
Operating Temperature
5°C - 35°C (41°F - 95°F)
Storage & Transportation
Temperature
-40°C - 60°C
Operating Humidity
20% - 80% relative humidity
Storage & Transportation
Humidity
20% - 93% (40°C) relative humidity
