Application Note
page 15 of 33
V1.7
2022-08-01
XENSIV™ BGT60LTR11AIP shield
60 GHz radar system platform
Hardware description
3.10
Layer-stack up and routing
The PCB is designed with a 4-layer stack up with standard FR4 material. Figure 16 shows the different layers
and their thicknesses.
Figure 16
PCB layer stack-up in 2D and 3D views
In the routing on the PCB, the VTUNE pin on BGT60LTR11AIP MMIC should be left floating. Any components
added to the line or a long wire connected can result in spurs.
