Infineon CoolGaN, Manual, Page: 21 / 23

Application Note 21 of 23 V 1.1
2020-11-09
CoolGaN™ 600 V half-bridge evaluation platform featuring GaN
EiceDRIVER™
Bill of materials
7 Bill of materials
The following table describes all of the components on the PCB:
Table 3 PCB BOM
Designator Description
C1 CAP ALUM 100UF 20% 450V 18D 35L 7.5P
C2, C3, C5, C6, C7 CAP 1uF 450V X7T 2220
C4 CAP CER 0.1UF 630V X7R 1210
C11, C21 CAP CER 330PF 16V C0G/NP0 0603
C12, C22 CAP CER 0.022UF 25V X7R 0603
C13, C23 CAP CER 0.1UF 25V X7R 0805
C14, C24 CAP CER 3000PF 25V NP0 0603
C15, C16, C25, C26, C32 CAP CER 0.1UF 25V X7R 0603
C17, C27 CAP CER 1000PF 16V C0G/NP0 0603
C31 CAP CER 1UF 16V X7R 0603
D11, D12, D13, D15, D21, D22, D23, D25 DIODE SCHOTTKY 30V 200MA SOD323
D14, D24 LED GREEN CLEAR 0805 SMD
J1 CONN MMCX JACK STR 50 OHM SMD
Q1, Q2 Infineon IGOT60R070D1 CoolGaN™ Transistor
R1, R2 RES SMD 499K OHM 1% 1W 2512
R11, R21 TRIMMER 1k OHM 0.125W SMD
R12, R15, R22, R25 RES SMD 470 OHM 1% 1/10W 0603
R13, R23 RES SMD 18K OHM 1% 1/10W 0603
R14, R24 RES SMD 10 OHM 1% 1/8W 0805
R16, R26 RES SMD 2.2K OHM 1% 1/10W 0603
R17, R27 RES SMD 10K OHM 1% 1/10W 0603
R18, R28 RES SMD 3.3 OHM 1% 1/10W 0603
R19, R29 RES SMD 1 OHM 1% 1/10W 0603
R31 RES 33K OHM 1% 1/10W 0603
R32, R33, R34, R35 RES SMD 200 OHM 1% 1/10W 0603
T1 Transformer (see section 3.2.1 for additional detail)
TP1 CONN MMCX JACK STR 50 OHM SMD
TP2, TP3, TP4, TP11, TP21 PCB built-in thru-hole test point pair
U1, U2 Infineon EiceDRIVER 1EDF5673K-B GaN Driver
U11 74AHCT1G08 IC GATE AND 1CH 2-INP SOT-353
U21 74AHCT1G04 IC SINGLE INVERTER GATE SOT353
U31 MAX256 IC DVR H-BRIDGE 3W 8-SOIC
X1 8-Position pluggable terminal block