Chapter
2.
Introducing
the
pSeries
655
The
pSeries
655
is
a
shared
multiprocessor
server.
The
processor
subsystem
can
be
configured
(or
partitioned)
as
multiple
separate
systems.
This
configuration
is
known
as
a
logically
partitioned
system.
The
processor
subsystem
is
described
in
“Processor
Subsystem”
on
page
8.
Other
options
for
a
rack
configuration
include
the
7040
Model
61D
I/O
Subsystem
and
7040
Model
W42
Integrated
Battery
Feature
(IBF)
for
the
power
subsystem.
The
following
components
comprise
configurations
of
the
pSeries
655
system:
v
Bulk
Power
Assembly
(BPA).
The
BPA
is
the
main
power
control
unit
for
the
pSeries
655
system.
This
redundant
bulk
power
assembly
distributes
power
at
350
V
to
each
drawer
where
conversion
is
made
to
the
required
chip
level.
The
BPA
contains
the
following
components:
–
Bulk
Power
Regulator
(BPR)
–
Bulk
Power
Controller
(BPC)
–
Bulk
Power
Distributor
(BPD)
–
Bulk
Power
Jumper
(BPJ)
-
optional
v
Processor
Subsystem
.
The
processor
subsystem
is
a
4
EIA-unit-high
drawer.
The
processor
subsystem
contains:
–
One
multichip
module
(MCM)
processor
operating
at
one
of
the
following
speeds:
-
1.1
GHz
(8-way)
-
1.3
GHz
(4-way)
-
1.5
GHz
(8-way)
-
1.7
GHz
(4-way
–
Four
L3
cache
modules
–
Two
externalized
RIO
or
RIO-2
ports
–
One
pair
of
internal
RIO
or
RIO-2
ports
servicing
three
PCI-X
slots,
two
10/100
Ethernet
adapters,
a
dual
SCSI
adapter,
and
a
service
processor
card
–
Fan
assembly
–
Two
3.5-inch
SCSI
DASD
bays
–
Four
memory
cards
with
a
minimum
of
4
GB
and
a
maximum
of
64
GB
of
memory
The
processor
subsystem
contains
the
Distributed
Converter
Assembly
(DCA)
used
in
the
conversion
of
350
V
bulk
power
to
the
supply
voltages
required
by
the
various
internal
components.
The
minimum
memory
required
to
operate
this
system
is
4
GB,
and
the
maximum
amount
of
memory
is
32
GB.
v
Integrated
Battery
Feature
(IBF).
The
IBF
is
a
2
EIA-unit-high
drawer
that
can
be
added
to
your
system.
The
IBF
is
optional
and
provides
backup
electric
power
in
case
of
a
power
outage.
You
can
install
up
to
six
IBFs
in
the
rack
configuration.
The
total
number
of
IBFs
that
can
be
installed
depends
upon
the
number
of
processor
subsystems
and
I/O
subsystems
installed
in
the
rack.
v
I/O
Subsystem
.
Each
I/O
subsystem
is
a
4
EIA-unit-high
subsystem
containing
up
to
two
I/O
boards,
up
to
16
disk
drives,
four
DASD
backplanes,
a
midplane
card,
four
cooling
fans,
and
two
power
supplies
(which
are
independent
of
the
bulk
power
assembly).
A
rack
can
have
up
to
five
I/O
subsystems
with
each
drawer
having
20
PCI
card
slots,
and
more
than
500
GB
of
storage.
Note:
If
your
system
configuration
contains
IBFs,
the
rack
drawer
space
may
be
limited
for
I/O
subsystems.
7
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