Figure 74. Removing the heat sink
5. Place the heat sink upside down on a clean surface.
6. Using tweezers, carefully remove the TIM from the top of the system processor module and place it in
a clean, dry area.
The TIM can tear easily.
7. Remove the cover from the system processor socket on the new system backplane
8. Inspect the system processor socket area and remove any dust or debris (use a can of compressed
air).
9. Align the tool with the beveled edge (A) of the system processor module as shown in the following
figure. Lower the tool over the system processor module by ensuring the two guide pins (C) are
inserted into the alignment holes (B) on each side of the tool.
Removing and replacing parts in the 7063-CR2 57
