HP Integrity BL890c - i2 Server, Installation Manual

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For the location of the SAS disk LEDs, see “SAS disk drive LEDs” (page 13) .
SAS disk backplane
The SAS disk backplane supports two small form factor hard disk drives. The backplane supports
hot-plugging a single SAS drive at a time. The activity LEDs and drive present LEDs are controlled
by a preprogrammed system-on-chip. The system board hosts the SAS controller and supplies
12 V, 5 V, and 3.3 V standby power to the backplane.
The SAS backplane is connected to the system board with a right angle connector. This connector
is specifically designed for high-speed differential applications, and supports server speeds
exceeding 5 Gigabits per second. Power, sense, and I
2
C signals are routed through this connector
as well as the SAS differential pairs and SGPIO signals.
I/O subsystem
The I/O subsystem is composed of embedded core I/O and up to three mezzanine cards. The
server blade supports the following configurations:
•
Up to three type I mezzanine cards
• One type I and up to two type II mezzanine cards using up to x8-PCIe Gen-2 links
The server blade does not support PCI Hot Plug.
Partner blade support
The partner blades currently supported are the SB40c storage blade (411243-B21) and the HP
BLc PCI Expansion Blade (448018-B21).
Partner blade slotting rules are dependent on the conjoined blade configuration. For more
information on partner bay blade locations, see
“Installing the Scaleable BladeLink” (page 39) .
Memory subsystem
The BL860c i2 physical memory subsystem connects two Itanium® processors to two groups of
12 DDR3 DIMMs. Each processor has two memory controllers.
DIMMs
The memory subsystem supports only DDR3 SDRAM technology using industry-standard 1.2”
high DIMMs.
BL890c i2 Min / Max
Memory size BL870c i2 Min / Max
Memory size BL860c i2 Min / Max
Memory size Single DIMM
sizes
Not supported Not supported 8 GB / 48 GB 2 GB
32 GB / 384 GB 16 GB / 192 GB 8 GB / 96 GB 4 GB
32 GB / 768 GB 32 GB / 384 GB 16 GB / 192 GB 8 GB
For more DIMM information, see “Installing DIMMs” (page 26) .
Power subsystem
The power subsystem is located on the system board. Each server blade receives bulk DC voltage
from the enclosure. The server blade power block converts the DC voltage from the enclosure
to the voltage required by the server blade. The BL860c i2 Server Blade receives 12 V directly
from the enclosure. The voltage passes through E-Fuse circuitry that resides in the blade. The 12
V supply is on as long as a power supply is installed in the enclosure. A control line from the
enclosure OA can turn the E-Fuse on or off to supply or cut power to the blade. The 12 V gets
distributed to various POL converters. The switched POL voltage rails are: 0.9 V, 1.2 V, 1.5 V,
1.8 V, 2.5 V, 3.3 V, 5.0 V, 3.3 V standby, and 5.0 V standby.
Overview 9