3 Development Board Circuit
3.8 MIPI DSI
DBUG375-1.2E
17(34)
Table 3-8 LVDS TX2 Pinout
Pin
No.
Name
FPGA
Pin No.
BANK
I/O Level
Description
1
LVDS_A1_P
W19
4
2.5V
Differential Channel 1+
2
LVDS_A1_N
V19
4
2.5V
Differential Channel 1-
5
LVDS_A2_P
W17
4
2.5V
Differential Channel 2+
6
LVDS_A2_N
W18
4
2.5V
Differential Channel 2-
9
LVDS_A3_P
AB19
4
2.5V
Differential Channel 3+
10
LVDS_A3_N
AB20
4
2.5V
Differential Channel 3-
13
LVDS_A4_P
AA20
4
2.5V
Differential Channel 4+
14
LVDS_A4_N
Y20
4
2.5V
Differential Channel 4-
17
LVDS_A5_P
AB17
4
2.5V
Differential Channel 5+
18
LVDS_A5_N
AB18
4
2.5V
Differential Channel 5-
Table 3-9 LVDS TX2 Pinout
Pin
No.
Name
FPGA
Pin No.
BANK
I/O Level Description
1
LVDS_A6_P
Y14
4
2.5V
Differential Channel 6+
2
LVDS_A6_N
Y15
4
2.5V
Differential Channel 6-
5
LVDS_A7_P
W14
4
2.5V
Differential Channel 7+
6
LVDS_A7_N
W15
4
2.5V
Differential Channel 7-
9
LVDS_A8_P
AB13
4
2.5V
Differential Channel 8+
10
LVDS_A8_N
AB14
4
2.5V
Differential Channel 8-
13
LVDS_A9_P
Y12
4
2.5V
Differential Channel 9+
14
LVDS_A9_N
Y13
4
2.5V
Differential Channel 9-
17
LVDS_A10_P V12
4
2.5V
Differential Channel 10+
18
LVDS_A10_N V13
4
2.5V
Differential Channel 10-
3.8
MIPI DSI
3.8.1
Introduction
The DSI interface uses the 30-contact stacked board connector, which
channels to 5 pairs of differential signals, including one for clock and four
for data, corresponding to TXD T550UZPA-75 mobile phone screen
interface. At the same time, DSI signals of 5 lanes are channeled to the
double rows pin of 20pin with 2.00mm pitch.