2
FUJITSU SEMICONDUCTOR CONFIDENTIAL
MB86R12 Application Note
DDR3 Interface PCB
Design Guideline
2. PCB laminating
This chapter shows the recommended laminating conditions of the PCB.
Figure 2-1 PCB laminating
Specified condition of wiring layer
•
L1 and L8 are used as wiring and pull-out wiring layer of CLK.
•
L3 and L6 are used as wiring layer of DQS, DQ, and CMD/ADD.
•
L2 and L5 are used as power layer.
•
L4 and L7 are used as GND layer.
Conductor
thickness
Insulator thickness
L1
43μm SIG. (copper foil: 18mm, plating: 25mm)
L2
35μm Power
L3
35μm SIG.
L4
35μm GND
L5
35μm Power
L6
35μm SIG.
L7
35μm GND
L8
43μm SIG. (copper foil: 18mm, plating: 25mm)
Resist thickness
40μm
100μm
150μm
150μm
1
00μm
150μm
150μm
100μm
40μm
Insulation material: relative permittivity=4.3 (only the resist part is 3.9)
Classification
Resist thickness
