Fuji Electric Co., Ltd.
2-5
MT6M12343 Rev.1.0
Dec.-2016
Chapter 2
Description of Terminal Symbols and Terminology
Item
Symbol
Description
Junction to Case Thermal
Resistance
(per single IGBT)
R
th(j-c)_IGBT
Thermal resistance from the junction to the case of a single IGBT.
Junction to Case Thermal
Resistance
(per single FWD)
R
th(j-c)_FWD
Thermal resistance from the junction to the case of a single FWD.
Case to Heat sink
Thermal Resistance
R
th(c-f)
Thermal resistance between the case and heat sink, when mounted on a heat
sink at the recommended torque using the thermal compound
(3) BSD block
(5) Mechanical Characteristics
Item
Symbol
Description
Tighten torque
-
Screwing torque when mounting the IPM to a heat sink with a specified screw.
Heat-sink side flatness
-
Flatness of a heat sink side. See Fig.2-3.
Fig.2-1 Switching waveforms
Table 2-2 Description of Terminology
Item
Symbol
Description
Forward voltage of
Bootstrap diode
V
F(BSD)
BSD Forward voltage at a specified forward current.
(4) Thermal Characteristics
10%
10%
90%
2.1V
90%
I
rp
t
rr
t
d(on)
t
r
t
c(on)
t
on
10%
10%
90%
0.8V
t
d(off)
t
f
t
c(off)
t
off
V
CE
I
C
I
C
V
CE
V
IN
V
IN
