2010-06-30
Page 27 of 42
IT430_Tech_doc.doc
5
MANUFACTURING
5.1 Assembly and soldering
The IT430 module is intended for SMT assembly and soldering in a Pb-free reflow process on
the top side of the PCB. Suggested solder paste stencil height is 150um minimum to ensure
sufficient solder volume. If required paste mask pad openings can be increased to ensure proper
soldering and solder wetting over pads.
Use pre-heating at 150… 180 ºC for 60… 120 sec. Suggested peak reflow temperature is 235…
245ºC (for SnAg3.0Cu0.5 alloy). Absolute max reflow temperature is 260ºC. For details see
Fastrax document ‘Soldering Profile’ (
ref IV
).
Note that module is Electrostatic Sensitive Device (ESD). Rated voltage is 50V max (Machine
Model) at RF_IN signal.
NOTE
Note that module is Electrostatic Sensitive Device (ESD),
rating 50V max (Machine Model) at RF_IN.
Avoid also ultrasonic exposure due to internal crystal and SAW components.
The IT430 module meets the requirements of Directive 2002/95/EC of the European Parliament
and of the Council on the Restriction of Hazardous Substance (RoHS). For details contact
Fastrax support.
5.2 Moisture sensitivity
IT430 module is moisture sensitive at MSL 3 (see the standard IPC/JEDEC J-STD-020C). The
module must be stored in the original moisture barrier bag or if the bag is opened, the module
must be repacked or stored in a dry cabin (according to the standard IPC/JEDEC J-STD-033B).
Factory floor life in humid conditions is 1 week for MSL 3.
Moisture barrier bag self life is 1 year; thus it is suggested to assemble modules prior self life
expiration. If the moisture barrier bad self life is exceeded, the modules must be baked prior
usage; contact Fastrax support for details.
5.3 Marking
Module marking includes type and batch code and serial number.
Type code is e.g.
IT430-401S-SGT-3595
(may vary)
,
where
Summary of Contents for IT430
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