144
Applies to
1
Parameter
Conditions
Min
Max
Units
FPGA die temperature
80 [176] °C [°F]
Ambient air temperature
150 LFM minimum
required airflow
0 [32] 55 [131] °C [°F]
Ambient air humidity
Non-condensing
10
90
% RH
Applies to
2
Parameter
Conditions
Min
Max
Units
FPGA die temperature
95 [203] °C [°F]
Ambient air temperature
150 LFM minimum
required airflow
0 [32] 55 [131] °C [°F]
Ambient air humidity
Non-condensing
10
90
% RH
Applies to
3
Parameter
Conditions
Min
Max
Units
FPGA die temperature
95 [203] °C [°F]
Ambient air temperature
250 LFM minimum
required airflow
0 [32] 55 [131] °C [°F]
Ambient air humidity
Non-condensing
10
90
% RH
Applies to
4
Parameter
Conditions
Min
Max
Units
Ambient air temperature
0 [32] 55 [131] °C [°F]
Ambient air humidity
Non-condensing
10
90
% RH
1
1633-LH Coaxlink Quad G3 LH
.
2
3621-LH Coaxlink Mono CXP-12 LH
.
3
3622-LH Coaxlink Duo CXP-12 LH
.
4
1625 DB25F I/O Adapter Cable
,
1636 InterPC C2C-Link Adapter
,
3300 HD26F I/O module for Coaxlink Duo
PCIe/104
,
3301 Thermal drain (Model 1) for Coaxlink Duo PCIe/104
,
3302 DIN1.0/2.3 Coaxial cable for Coaxlink
Duo PCIe/104
,
3303 C2C-Link Ribbon Cable
,
3304 HD26F I/O Adapter Cable
,
3610 HD26F I/O Extension Module -
TTL-RS422
,
3612 HD26F I/O Extension Module - TTL-CMOS5V-RS422
,
3613 JTAG Adapter Xilinx for Coaxlink
,
3614
HD26F I/O Extension Module - Standard I/O Set
,
3617 HD26F I/O Extension Module - TTL-CMOS5V
and
3618 HD26F
I/O Extension Module - Fast I/O
.
eGrabber
Hardware Manual
