Introduction
P2-133A
Page 1-3
packaging technology and each of the physical elements of the product are referred
to using accurate technical descriptions. This allows clear reference to the products
as just a processor. This is the model used in past packaging technologies like PGA,
TCP, PQFP, DIP, etc.
S.E.C. Cartridge Terminology
•
Pentium
®
II or Deschutes Processor
The new enclosed card packaging technology is called a “Single Edge
Contact cartridge.” This is similar to previous names for packaging
technology such as PGA or TCP.
•
Processor card
The green PCB (with or without components on it)
•
Processor core
The silicon on the PLGA package on the PCB
•
Cover
The plastic cover on the opposite side from the thermal plate.
•
Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
®
Pro
processor uses Socket 8.
•
Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the cartridge
in place.
•
Thermal plate
The heatsink attachment plate.
•
Heat sink supports
Figure 1: Pentium
®
II or Deschutes
Processor CPU with S.E.C. Cartridge
Processor
Printed Circuit Board
Thermal Plate
Cover
The support pieces that are
mounted on the mainboard
to provide added support for
heatsinks.
The L2 cache (TagRAM, PBSRAM)
components keep standard industry
names.
The Pentium
®
II or Deschutes Processor
is the first product to utilize the S.E.C.
cartridge technology and Slot 1
connector. Unless otherwise noted, any
references to “Pentium
®
II Processor,”