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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
14.0 RoHS Restricted Materials
Table 15 lists Restriction of Hazardous Substances (RoHS) materials.
Table 15 RoHS Materials
Material
Location
Cadmium (Cd)
Absent
Hexavalent Chromium (Cr VI)
Absent
Lead (Pb)
Absent
Mercury (Hg)
Absent
Polybrominated Biphenyls (PBB)
Absent
Polybrominated Diphenyl Ethers (PBDE)
Absent
All units are shipped RoHS compliant and contain Lead (Pb) only when specifically
exempted.
The following are possible exemptions for this product:
RoHS Exemption 6c: Lead as an alloying element in copper containing up to 4%
lead by weight
RoHS Exemption 7a: Lead in high melting temperature type solders (i.e. lead based
alloys containing 85 % by weight or more lead)
RoHS Exemption 7b: Lead in solders for servers, storage and storage array systems,
network infrastructure equipment for switching, signaling, transmission; and network
management for telecommunications
RoHS Exemption 7c-I: Electrical and electronic components containing lead in a
glass or ceramic other than dielectric ceramic in capacitors , e.g. piezoelectronic
devices, or in a glass or ceramic matrix compound
RoHS Exemption 7c-II: Lead in dielectric ceramic in capacitors for a rated voltage
of 125 V AC or 250 V DC or higher
RoHS Exemption 15: Lead in solders to complete a viable electrical connection
between semiconductor die and carrier within integrated circuit flip chip packages
RoHS Exemption 24: Lead in solders for the soldering to machined through hole
discoidal and planar array ceramic multilayer capacitors
