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41
WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
Figure 30. Removing four top PCB screws
3.
Disconnect the power/cooling module wiring from the bottom PCB and remove the
top PCB.
Figure 31. Removing the top PCB
13.0.4.3 Removing materials in the DC Power/Cooling Module
1.
Detach the heat fins.
2.
To remove the wiring: