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WEEE Disassembly Instructions for the
TAE and TAE-DC Disk Array Enclosure
13.0.5 Disassembling the Chassis for Recycling and Retrieving the
Midplane PCB
To disassemble the 25-slot chassis:
1.
Remove all components listed in
13.0 Disassembling the TAE and TAE-DC Disk Array
Note: All materials that make up the chassis are ready for recycling after all components
are removed.
2.
Remove the four screws that attach the chassis top cover.
5.
Flip over the chassis and remove the four screws on the bottom of the chassis.
6.
Return the chassis to its front facing position to access the LCC housing.
7.
Remove the LCC housing.
8.
To remove the two power/cooling module air flappers and two LCC assembly air flappers
(highlighted):
a.
Squeeze the tabs to release each air flapper.
b.
Detach and remove from the hinges.
Figure 32. Locating air flappers
7.
To remove the midplane PCB:
a.
Remove the ten screws that attach the midplane PCB to the midplane
assembly.
b.
Detach the black, frame-like insulator from the midplane PCB.
Figure 33. Midplane PCB
