Application Information
4-4
TSEV81102G0FS Evaluation Board User Guide
0974C–BDC–02/09
e2v semiconductors SAS 2009
DelAdjCtrlb
, as shown in Figure 4-2 on page 4.
Figure 4-2.
Delay Adjustment Characteristics (T
J
= 60
°
C)
Note:
The variation of the delay depending on the temperature is insignificant.
4.6
Die Junction
Temperature
Monitoring
Figure 4-3.
Diode for Die Junction Temperature Monitoring Characteristics (I = 1 mA)
4.7
Applying the
TSEV81102G0FS
DMUX to e2v
ADC Evaluation
Boards
The TSEV81102G0FS DMUX evaluation board is designed to be fully compatible with
e2v’s TSEV8388B and TSEV83102G0B ADC evaluation boards.
Figure 4-4 on page 5 shows the ADC and DMUX board connections and Table 4-2 pro-
vides the required configuration to match the DMUX board with the ADC board.
When used with the TSEV8388BF/FZA2 boards, the TSEV81102G0FS DMUX board
can be plugged directly to the ADC output connector with the DMUX device on top of the
board.
When it is used with the TSEV8388BGL/GLZA2 or TSEV83102G0BGL ADC boards, the
TSEV81102G0FS DMUX board must be turned over, with the device on the bottom of
the board and I0 matched with D0 of the ADC board.
-350
-250
-150
-50
50
150
250
350
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
V Demux Del Adj Crtl (V)
De
la
y
(
p
s
)
640
660
680
700
720
740
760
780
800
820
840
860
880
900
920
940
960
980
1000
-60
-40
-20
0
20
40
60
80
100
120
140
Tj (˚C)
V
o
ltage
(
m
V
)
